Saturday, June 15, 2024

Ever-emerging technologies bring new and improved processing materials engineered for specific surfacing applications. We offer a comprehensive line of precision polishing compounds, from sub-micron particle sizes on up, each uniquely suited for lapping and polishing. With advanced formulations for cerium and rare earth oxides, colloidal silica, aluminum oxide, natural and manmade diamond powders, slurries, and compounds, along with a distinctive collection of polishes for nano-processing, UPI covers the polishing requirements of most any surfacing application.

If you do not see what you're looking for, please call our expert customer service team directly. We'll gladly recommend products specific to your unique application.