Electronic Surfacing

PRODUCT CONFIGURATIONS

FULL PADS Available up to 65 inches
SEGMENTED PADS Diameters larger than 66 inches
GROOVING Available in a variety of grooving patterns

ESM-U

ESM-57

ESM-013

ESM-013

UNI-NAP 13

UNI-NAP 13

Uni-Nap is an intrinsic napped poromeric material with uniform pore structure and high pore wall strength. Its consistent, uniform pore size, excellent surface finish and long life are the results of tightly controlled manufacturing parameters ideal for final polishing processes. Available in a variety of grooving patterns and sizes - as well as custom configurations.

ESM-013‘s unique micro-cellular structure enables it to act in a “sponge-like” manner while maintaining the hardness and flatness necessary in critical surface preparations. Available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial CMP tools.

A unique micro-cellular foamed elastomer with controlled cells, the ESM-57 has been designed for increased pad performance. Its unique pore distribution allows lower required down force and processing consistency, thereby improving planarity, increasing removal rate, and providing longer life in substrate applications. Available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial CMP tools.

A unique micro-cellular foamed elastomer with controlled cells designed to increase pad performance for CMP users. Its unique structure improves planarity, increases removal rate, and provides longer life on a variety of CMP applications. Available in a variety of standard grooving patterns and sizes - as well as custom configurations - to support all commercial CMP tools.

Advancements in electronics surfacing dictate specific solutions to the processing challenges they present.

Universal Photonics’ product line has been developed to address a comprehensive matrix of fabrication processes for:

Disk
Silicon wafer
Integrated circuit (IC)

Over 75+ years polishing expertise and a working knowledge of the latest technologies allow us to proudly offer a wide range of high quality, cost effective consumables. To meet the stringent requirements of the semiconductor industry, we manufacture a wide variety of pads and provide the technical know-how to meet the needs of virtually all electronic surfacing and polishing disciplines.

Our commitment to cutting-edge solutions is supported by our strong foundation in the physical/material sciences, and process/application engineering.

Welcome to Electronic Surfacing